Semiconductor Engineering

Six 3D-IC Design Trends That Secure The AI Era

The pace of innovation in advanced packaging is rewriting the rules that IC and package teams have relied on for decades.
Electronic Design

Management IC For 1-Cylinder Engines Reduces Emissions

Infineon's new TLE808x engine management IC family provides all the functionality required for state-of-the-art EFI in one-cylinder combustion engines. Infineon's new TLE808x engine management IC ...
EDN

Thermal analysis tool aims to reinvigorate 3D-IC design

The mainstream adoption of 3D-IC has become a question mark due to critical challenges ranging from early-stage chip designs to 3D assembly exploration to final design signoff. A new EDA tool claims ...
Just Auto

Mercedes-Benz Group gets grant for patent on internal combustion engine with valve clearance compensation

Mercedes-Benz has been granted a patent for an internal combustion engine that includes a crankshaft, camshaft, cylinder, piston, gas exchange valve, valve clearance compensation device, and a control ...