TE Circuit Protection has developed a 0201-size Silicon ESD (SESD) devices that are commonly used in portable electronic devices. This document was made as a guide for developing the proper PCB design ...
BIEL, Switzerland--(BUSINESS WIRE)--IXYS Corporation (NASDAQ:IXYS) announces the expansion of its discrete ISOPLUS TM technology to introduce power modules as Surface Mount Devices (SMD). The IXYS ...
Pune, Aug. 10, 2022 (GLOBE NEWSWIRE) -- Surface-mount technology (SMT) is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface of printed ...
A new family of larger connectors is compatible with through-hole PCB mounting for strength and reflow soldering in ...
When you purchase through links on our site, we may earn an affiliate commission. Here’s how it works. The Surface Mounted Devices (SMD) manufacturing process encapsulates one red chip, one green chip ...
A circuit board packaging technique in which the leads (pins) on the chips and components are soldered on top of the board. Boards can be made faster because surface mount technology (SMT) eliminates ...
New devices offer smaller form factors to save space and simplify manufacturing versus competing leaded devices in AC line filtering applications FORT LAUDERDALE, Fla., Dec. 02, 2019 (GLOBE NEWSWIRE) ...
Farmington, March 14, 2023 (GLOBE NEWSWIRE) -- The Surface Mount Technologies Market Revenue Assumed By The End Of 2022 Was US$ 4.6 Billion. The Surface Mount Technology Market Is Expected To Reach ...
The importance of SMT in PCB manufacturing. How SMT can be beneficial for PCB manufacturers. Have you opened an electronic device and found some small component networks? You see pieces of different ...
TODAY'S CUTTING EDGE INTEGRATED CIRCUITS DISSIPATE SUBSTANTIALLY HEAVIER LOADS OF HEAT THAN EVER BEFORE. At the same time, the premium associated with miniaturized applications has never been greater, ...
If you are lucky enough to encounter a piece of homebrew electronics from the 1950s, the chances are that under the covers the components will be assembled on solder tags, each component with long ...
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