A new study has revealed how tiny imperfections and vibrations inside a promising quantum material could be used to control an unusual quantum effect, opening new possibilities for smaller, faster, ...
Abstract: Hybrid wafer bonding is a key technology for enabling fine-pitch 3D integration, yet its quality remains highly sensitive to wafer warpage and misalignment. This study develops a 3D finite ...
In the everyday world, governed by classical physics, the concept of equilibrium reigns. If you put a drop of ink into water, ...
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